Machinery & equipment
Viatron
Display process equipment · Die bonders · Semiconductor process equipment
Products and specifications
Machinery & equipment
Display process equipment
Product family identified on the company’s official website.
Request a model-specific datasheet for dimensions and performance values.
Explore this product → · Official product source ↗Machinery & equipment
Die bonders
Die-bonding equipment for mounting dies or plates, with the maximum substrate format stated on the official product introduction.
| Parameter | Specification |
|---|---|
| Maximum substrate size | 600 × 600 mm |
Machinery & equipment
Semiconductor process equipment
Product family identified on the company’s official website.
Request a model-specific datasheet for dimensions and performance values.
Explore this product → · Official product source ↗Product catalog
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